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Transient electronics take shape

Published:26 September 2018Publication History
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Abstract

Advances in materials science and chemistry are leading to self-destructing circuits and transient electronics, which could impact many fields.

References

  1. Gund, V., Ruyack, A., Camera, K., Ardanuc, S., Ober, C., and Lal, A. (2015). Multi-modal graphene polymer interface characterization platform for vaporizable electronics. 2015. 873-876. 10.1109/ MEMSYS.2015.7051098. https://www.researchgate.net/publication/283633594_Multi-modal_graphene_polymer_interface_characterization_platform_for_vaporizable_electronicsGoogle ScholarGoogle Scholar
  2. Gund, V., Ruyack, A., Camera, K., Ardanuc, S., Ober, C., and Lal, A. (2016). Transient Micropackets for Silicon Dioxide and Polymer-Based Vaporizable Electronics. 1153-1156. 10.1109/MEMSYS.2016.7421840. https://www.researchgate.net/publication/301709792_Transient_micropackets_for_silicon_dioxide_and_polymer-based_vaporizable_electronics.Google ScholarGoogle Scholar
  3. Chang, J., Fang, H., Bower, C.A., Song E., Yu, X., and Rogers, J.A. Materials and processing approaches for foundry-compatible transient electronics. Proceedings of the National Academy of Sciences Jul 2017, 114 (28) E5522-E5529; http://www.pnas.org/content/114/28/E5522Google ScholarGoogle ScholarCross RefCross Ref
  4. Gao, Y., Zhang, Y., Wang, X., Sim, K., Liu, J., Chen, J., Feng, X., Xu, H., and Yu, C. Moisture-triggered physically transient electronics. Science Advances, Sept. 1, 2017: Vol. 3, no. 9, e1701222 http://advances.sciencemag.org/content/3/9/e1701222.full.Google ScholarGoogle Scholar

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  1. Transient electronics take shape

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      cover image Communications of the ACM
      Communications of the ACM  Volume 61, Issue 10
      October 2018
      107 pages
      ISSN:0001-0782
      EISSN:1557-7317
      DOI:10.1145/3281635
      Issue’s Table of Contents

      Copyright © 2018 ACM

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      Association for Computing Machinery

      New York, NY, United States

      Publication History

      • Published: 26 September 2018

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