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And then, there were three

Published:21 May 2019Publication History
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Abstract

How long can the silicon foundry sector continue to adapt, as physical limits make further shrinkage virtually impossible?

References

  1. International Roadmap for Devices and Systems 2017 Edition, IEEE, https://irds.ieee.org/roadmap-2017.Google ScholarGoogle Scholar
  2. Shih, W. C., Chien, C. F., Shih, C., and Chang, J. The TSMC Way: Meeting Customer Needs at Taiwan Semiconductor Manufacturing Co., Harvard Business School Case Collection 610-003, August 2009, https://www.hbs.edu/faculty/Pages/item.aspx?num=37868.Google ScholarGoogle Scholar
  3. Monroe, D. Electronics are Leaving the Plane, Communications, August 2018, https://cacm.acm.org/magazines/2018/8/229776-electronics-are-leaving-the-plane/fulltext. Google ScholarGoogle ScholarDigital LibraryDigital Library

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  1. And then, there were three

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      cover image Communications of the ACM
      Communications of the ACM  Volume 62, Issue 6
      June 2019
      85 pages
      ISSN:0001-0782
      EISSN:1557-7317
      DOI:10.1145/3336127
      Issue’s Table of Contents

      Copyright © 2019 ACM

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      Association for Computing Machinery

      New York, NY, United States

      Publication History

      • Published: 21 May 2019

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