Electronics are leaving the plane

Abstract

Stacking chips and connecting them vertically increases both speed and functionality.

References

1. Lapedus, M. A New Memory Contender?, Semiconductor Engineering, January 2, 2018, http://bit.ly/2DbliT2
2. Kondo, K., Kada, M., and Takahashi, K. (Eds.) Three-Dimensional Integration of Semiconductors, Springer International Publishing, 2015, http://bit.ly/2G6uXxd
3. 3D Stacked Memory: Patent Landscape Analysis Lexinnova Technologies LLC, http://bit.ly/2tuC0Ny

Index Terms

• Hardware

  • Integrated circuits

    • 3D integrated circuits

  • Very large scale integration design

    • Economics of chip design and manufacturing