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The Future of HCI and Sustainability: Championing Environmental and Social Justice.

Published:20 April 2018Publication History

ABSTRACT

In this SIG, we propose a gathering of the HCI and Sustainability SIGCHI community to strategise future initiatives. This gathering is open to all attendees of CHI'18 and aims to foster an inclusive dialogue about the myriad challenges stemming from the intertwined issues of digital technology design and use with environmental and social justice. As a sustainability-focused SIGCHI community, it is our duty to remain committed to promoting environmental and social justice---a commitment that is particularly timely given the number of digitally mediated global events challenging those entwined notions of justice. In the midst of our rapidly changing and globalised context, this SIG offers space for CHI'18 attendees to strategise about the goals, directions, and initiatives of HCI and Sustainability community. We aim to develop draft outcomes as a seed for ongoing collaborative discussion and development of the HCI and Sustainability community for the next 2-5 years.

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References

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    • Published in

      cover image ACM Conferences
      CHI EA '18: Extended Abstracts of the 2018 CHI Conference on Human Factors in Computing Systems
      April 2018
      3155 pages
      ISBN:9781450356213
      DOI:10.1145/3170427

      Copyright © 2018 Owner/Author

      Permission to make digital or hard copies of part or all of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for third-party components of this work must be honored. For all other uses, contact the Owner/Author.

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      Association for Computing Machinery

      New York, NY, United States

      Publication History

      • Published: 20 April 2018

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      Acceptance Rates

      CHI EA '18 Paper Acceptance Rate1,208of3,955submissions,31%Overall Acceptance Rate6,164of23,696submissions,26%

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